- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
Patent holdings for IPC class H05K 7/20
Total number of patents in this class: 24312
10-year publication summary
1581
|
1718
|
1797
|
1945
|
2126
|
2304
|
2329
|
2547
|
2683
|
1008
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Dell Products L.P. | 11144 |
535 |
Huawei Technologies Co., Ltd. | 100781 |
463 |
Intel Corporation | 45621 |
396 |
Samsung Electronics Co., Ltd. | 131630 |
393 |
International Business Machines Corporation | 60644 |
357 |
Mitsubishi Electric Corporation | 43934 |
346 |
Hewlett Packard Enterprise Development LP | 10702 |
326 |
Denso Corporation | 23338 |
304 |
Microsoft Technology Licensing, LLC | 51439 |
283 |
Fujitsu Limited | 19265 |
269 |
Baidu USA LLC | 1085 |
236 |
Google LLC | 38759 |
228 |
Hitachi Astemo, Ltd. | 5618 |
198 |
Sumitomo Wiring Systems, Ltd. | 9367 |
196 |
Sumitomo Electric Industries, Ltd. | 14131 |
192 |
Amazon Technologies, Inc. | 24422 |
189 |
ZTE Corporation | 39218 |
188 |
NEC Corporation | 32703 |
174 |
Hewlett-Packard Development Company, L.P. | 28538 |
174 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
172 |
Other owners | 18693 |